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MOSIS; CMP; CMC

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News articles for MOSIS; CMP; CMC:

Tuesday, June 22, 2010

  • MOSIS, CMP and CMC Partner to Introduce a 3D-IC Process
    MARINA DEL REY, CA -- (Marketwire) -- 06/22/10 -- MOSIS, CMP and CMC are partnering to offer a 3D-IC Multi-Project Wafer (MPW) service based on Tezzaron Semiconductor's SuperContact technology and GLOBALFOUNDRIES' 130nm CMOS process. The first MPW run is targeting January 2011: 2-tier face-to-face bonded wafers 130nm CMOS process for ... read more