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Palomar Technologies

Website: http://www.palomartechnologies.com

Palomar Technologies News (2003-2004)
Tuesday, July 29, 2008
CARLSBAD--- Palomar Technologies Achieves Management Buy-out Posted 7:56 AM PST
 
Wednesday, April 16, 2008
Palomar Technologies Triples Cleanroom Capacity for Microelectronics Assembly Services Posted 8:21 AM PST
 
Tuesday, December 11, 2007
Palomar Technologies Partners with Vision Manufacturing, Inc. to add PWB and SMT Services for Palomar Microelectronics Posted 7:51 AM PST
 
Tuesday, November 6, 2007
Palomar Technologies Features High Throughput Automated Wire Bonding and Bumping plus Palomar Microelectronics at Productronica 2007 Stand B5.158 Productronica Stand B5.158 Posted 7:35 AM PST
 
Tuesday, October 30, 2007
Palomar Technologies Presents Two Papers at IMAPS: ''High Brightness LED Packaging'' and ''Gold to Gold Flip Chip Interconnect'' Posted 5:00 AM PST
 
Tuesday, September 11, 2007
Palomar Technologies Presents Methods to Improve Wire Bonding and Ball Bumping Geometries Posted 8:00 AM PST
 
Wednesday, August 1, 2007
CARLSBAD--- Palomar Technologies Wins 2007 Advanced Packaging Award for Wire Bonder Capabilities Posted 7:21 AM PST
 
Wednesday, July 11, 2007
Wedge Emulation on a Ball Bonder from Palomar Technologies Posted 9:04 AM PST
 
Thursday, May 10, 2007
High Value-Added Microelectronic Packaging from Palomar Technologies Posted 7:33 AM PST
 
Tuesday, October 17, 2006
CARLSBAD--- Palomar Technologies Receives ISO 9001:2000 Recertification Posted 6:58 AM PST
 
Thursday, July 27, 2006
Palomar Technologies' Latest Automatic Die Bonder Offers Increased Precision and Accuracy Posted 9:17 AM PST
 
Monday, January 23, 2006
CARLSBAD--- Bruce Hueners Named President of Palomar Technologies; Joined Palomar in 1981 Posted 9:55 AM PST
 
Tuesday, December 20, 2005
Palomar Wins Global Technology Award for its Precision Gold Wire Bonder and Ball Bumper Posted 7:12 AM PST
 
Monday, October 24, 2005
Prestigious AeA Award Given to Entropic Communications Posted 5:07 PM PST
 
Wednesday, July 6, 2005
NxGen Electronics Increases Its Complex Packaging Assembly Capabilities with the Addition of Palomar Technologies' Latest Bonders Posted 9:43 AM PST
 
Tuesday, March 29, 2005
Palomar Technologies Moves to New Facility in Carlsbad Posted 9:17 AM PST
 
Tuesday, December 21, 2004
VISTA--- Palomar Supplies Optoelectronic and Complex Packaging Assembly Equipment to Fabrinet Posted 9:36 AM PST
 
Tuesday, July 27, 2004
VISTA--- Palomar Technologies Wins 2004 Advanced Packaging Award for Its Model 8000 Precision Gold Wire Bonder and Ball Bumper Posted 6:09 PM PST
 
Tuesday, June 29, 2004
Automated Gold Wire Bonder from Palomar Technologies Combines High Net Throughput and Flexibility; Model 8000 Enables Precision Gold Wire Bonding Applications Posted 4:09 PM PST
 
Wednesday, June 2, 2004
760 Media Inc. Announces the Multi-Media Release of New Nimax Catalog and Launch of Rental Avenue Web site Posted 8:18 PM PST
 
Wednesday, April 7, 2004
CARLSBAD--- 760 Media Inc. Launches New Brand for Elgar Electronics Corp. Posted 3:12 PM PST
 
Tuesday, January 13, 2004
VISTA--- Palomar Technologies Wins UCSD CONNECT Most Innovative New Product Award; Winning Product Was Model 6500 Precision Eutectic Die Bonder Posted 5:33 PM PST
 
Wednesday, December 17, 2003
DuPont Photonics Selects the FAST 60 Optical Alignment System from Palomar Technologies Posted 9:30 AM PST
 
Wednesday, December 10, 2003
SAN DIEGO--- UC San Diego CONNECT Announces Most Innovative New Product -MIP- Award Winners Posted 5:04 PM PST
 
Tuesday, November 4, 2003
CARLSBAD--- 760 Media, Inc. Announces the Addition of Elgar Electronics to Portfolio Posted 5:42 PM PST
 
Tuesday, September 30, 2003
VISTA--- Palomar Technologies Offers Thermosonic Die Attach Services for Flip Chip Applications Posted 7:47 AM PST
 
Thursday, September 18, 2003
SAN DIEGO--- AeA Celebrates Local Technology Companies at 10th Annual High Tech Awards; San Diego Companies Recognized for Outstanding Achievement in Industry and Civic Contribution Posted 8:35 AM PST
 
VISTA--- Bruce Hueners of Palomar Technologies Elected to Editorial Board of Advanced Packaging Magazine Posted 8:51 AM PST
 
Tuesday, June 17, 2003
Coviant Selects Palomar Technologies to Automate Optical Manufacturing Posted 7:04 PM PST
 
Friday, May 30, 2003
Palomar Technologies Receives 2002 Inspire Award from the League of American Communications Professionals; Awarded for Employee Newsletter/Web Site Category Posted 6:56 AM PST
 
Tuesday, April 22, 2003
VISTA--- Palomar Technologies Introduces New Automatic Ball and Wedge Bonders; Reliable Wire Bonders for High Yield Production Posted 8:14 AM PST
 
Thursday, April 17, 2003
VISTA--- Palomar Technologies Selected as One of the 30 Best Small Electronics Companies by Electronic Business Magazine Posted 6:58 AM PST
 
Thursday, April 10, 2003
VISTA--- Palomar Technologies Selected as Fiberoptic Product News 2002 Technology Award Winner; Award Presented for Palomar's Gold Connection Flip Chip Bonding System Posted 8:05 AM PST
 
Tuesday, April 8, 2003
VISTA--- Palomar Technologies Introduces FAST 35 Assembly Tool; Automates the Active Optical Alignment and Attach of Active Photonic Components Posted 8:03 AM PST
 
Tuesday, April 1, 2003
Eblana Photonics Selects Palomar Technologies' Laser Diode Attach Assembly Cell for Volume Manufacturing Posted 7:33 AM PST
 
Tuesday, March 25, 2003
VISTA--- Palomar Technologies Introduces High Accuracy, High Speed Eutectic Die Bonder; Combines 1.5 Micron Eutectic Placement Accuracy and Speed in a Compact Footprint Posted 7:23 AM PST
 
Thursday, March 13, 2003
Palomar Technologies Selected by Hologic's Direct Radiography Division to Automate Assembly of Microelectronics Used in Medical Digital Imaging Posted 7:35 AM PST
 
Wednesday, March 12, 2003
Palomar Technologies Selected by Hologic's Direct Radiography Division to Automate Assembly of Microelectronics Used in Medical Digital Imaging Posted 3:04 PM PST
 
Wednesday, February 26, 2003
Palomar Introduces 6-Axis Optical Alignment Stage; Assembles an Optical Component, Fiber or Fiber Array to a Device Posted 8:58 AM PST
 
Tuesday, January 14, 2003
Palomar Technologies Introduces Die Bonders with Digital Dispensing Technology; Doubles Speed and Yielded Throughput in Small Dot Adhesive Die Bonding Applications Posted 7:49 AM PST
 
Thursday, January 9, 2003
Palomar Technologies Delivers 38th Wire Bonder to International Disk Drive Company; Automation Produces Highly Repeatable Process and Lowers Production Costs Posted 8:02 AM PST
 

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