Palomar Technologies to Exhibit at Semicon West 2009 Booth #621

CARLSBAD, CA -- (Marketwire) -- 07/08/09 -- Palomar Technologies, a world leader in providing solutions for microelectronics and optoelectronic packaging, and experts in precision wire bonding, complex hybrid packaging, and high accuracy die bonding systems, announced today that it will exhibit at Semicon West in San Francisco from July 14 to July 17.

Palomar invites its visitors to physically bring their microelectronics and optoelectronics packaging challenges to the booth table. Recent application solutions successes have been in the growth arenas of RF Power Modules, High Bright/High Power Matrix LED packages, Medical Devices, and Optoelectronic packaging. Palomar provides not only highly specialized contract assembly, but also customization of systems, tooling and software, world-wide field service technicians, and a deep rooted foundation of technological reliability and excellence.

Earlier this year, Palomar formed Alliances with three complementary system manufacturers: GPD Global, Hybond, Inc., and Royce Instruments. Palomar experts will be available to discuss GPD Global's precision fluid dispensing systems, Hybond's manual wire bonders, die bonders and wedge bonders, and Royce Instruments' lines of bond testers and die sorters.

Palomar's Sr. Scientist, Daniel D. Evans, Jr., will be presenting a paper on "Odd Form Factor Wire Bond Package Case Studies" at the concurrent IMAPS/SEMI Wirebonding Workshop held Monday, July 13. Discussion will be centered on the odd-form wire bond package requirements of RF, Automotive and Optical applications, which include more specialized capabilities of large form area and deep access.

Palomar Microelectronics is the development, test, and contract assembly division of Palomar Technologies. Contract assembly is an ideal solution for customers in need of immediate production of parts/packages while their customized wire and die bonding systems are being built. Start-ups and cash-strapped companies also benefit by getting scalable production accomplished while keeping capital costs low.

For more information find Palomar Technologies on the web at www.PalomarTechnologies.com, or visit Palomar's blog at Solutions.PalomarTechnologies.com.

About Palomar Technologies

Palomar Technologies, formerly part of Hughes Aircraft, is the world's foremost provider of wire bonders, gold wire bonders, die bonders and automated component placement systems. Palomar's process development and contract assembly services increase yield and lower costs for microelectronic device manufacturers in the telecommunications, medical, defense and aerospace and commercial high technology industries.

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