Palomar Technologies to Exhibit at IMAPS 2010 International Symposium on Microelectronics

CARLSBAD, CA -- (Marketwire) -- 10/27/10 -- Palomar Technologies announced today its exhibit at IMAPS 2010 International Symposium on Microelectronics, held at Raleigh Convention Center in Raleigh, North Carolina from November 1st-4th. Palomar will be showcasing its new, award winning 3800 Ultra Flexible Die Bonder in Booth #530.

Palomar's newest die bonder product has received worldwide acclaim for its performance and innovation in die attach technology. In October, the 3800 Ultra Flexible Die Bonder was awarded the 2010 Global Technology Award at SMTA International in Florida, and was named a finalist in the 2010 Tech America Awards. With 3.5 micron repeatability and 2600 UPH, the machine combines flexibility, precision, accuracy, and throughput in a single system. It also possesses the newest in design, mechanics, software and ergonomics.

Palomar engineers will be delivering two technical papers during the IMAPS symposium. Palomar Sr. Scientist Daniel D. Evans, Jr. will present "AuSi and AuSn Eutectic Die Attach Case Studies for Large (453 mil) and Small (12 mil) Die." He will discuss packaging requirements for high power transistors, lasers and LED devices. Materials such as Si and GaAs on CuW and GaN on SiC will be considered in this context. Also, processes for optimizing eutectic die attach and eutectic bond quality metrics including voiding, shear and fillet will be covered.

Applications Engineer Dave Rasmussen will present "Improved Bond Reliability through the use of Auxiliary Wires." Mr. Rasmussen will discuss the integrity of a wire bond interconnect and how it can usually be greatly improved through the proper use of Auxiliary Wires: Security Wires, Security Bumps, or Stand-Off Stitch (SOS). SOS has many applications and benefits that could be incorporated into a circuit design for better wire strength properties, fewer interconnects (die to die bonding), and lower loops.

About Palomar Technologies:

Palomar Technologies (formerly part of Hughes Aircraft Company) is the world's foremost supplier of automated high-precision wire bonders, die bonders and component placement systems combined with process development and contract assembly services to increase yield and lower costs for microelectronic device manufacturers. Visit Palomar online at www.palomartechnologies.com.

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