Palomar Technologies, provider of precision automation equipment and process development for microelectronic assembly, announces its new wedge emulation technology for low-profile interconnects, fine pitch, running-stitch interconnects, and die-to-die bonding in high-density packages such as LEDs and RF packages. Wedge emulation uses Palomar Technologies’ Model 8000 ball bonder to maximize the bonding speed, reliability, and reduced keep-out space of a ball bonder for high density packages that previously required a wedge bonder. Using a specially developed chain bonding stitch-stitch interconnect, this technique bonds 7 to 12 wires per second instead of the 1-2 wires per second you get with a wedge bonder.

Software allows the user to program an interconnect beginning with a stitch instead of ball, as in wedge bonding, and complies with the visual standards defined per Mil-Std-883, Method 2017. Since there is no ball, the user can use a wire other than gold, such as aluminum or copper, for the interconnect. This truly makes the ball bonder a viable and flexible alternative to a wedge bonder.

“There is little debate that ball bonding is faster and more robust,” said Don Beck, applications engineering manager for Palomar Technologies. “However, due to a need for low profile interconnects or