DesignCon 2013 Post-Show Report

SAN FRANCISCO, Feb. 5, 2013 /PRNewswire/ -- UBM Tech, whose portfolio includes essential business and technical information for design engineers and the electronics industry, held its annual DesignCon conference and expo last week in Santa Clara, Calif., where members of the chip, board and systems design community converged to take advantage of the show's four full days of intensive technical learning and networking opportunities. Featuring more than 120 in-depth tutorials, technical paper sessions and panel discussions designed to address the pervasive nature of signal integrity at all levels of electronic design, as well as three visionary keynotes, several sponsored training sessions, a host of technical and interactive theater sessions and 130+ exhibitors - more than any other design engineering event his season - attendance for DesignCon 2013 grew by 8%, supporting its reputation as the premier annual trade event for the semiconductor and electronic design industries.

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"DesignCon 2013 was a great success," said Wendy Yamaguma, Senior Events Director, UBM Tech Electronics. "Attendance was up, spirits were high, and we have already begun to receive excellent feedback about our content, events, speakers, and services." View photos from DesignCon.

Designed to provide attendees with unique opportunities to learn about cutting-edge technical developments and solutions from leading industry experts, the sold-out DesignCon 2013 expo featured several live product demonstrations and an abundance of dynamic new product announcements. A few standouts include:

    --  DesignCon Host Sponsor Agilent Technologies announced the expansion of
        its award-winning Infiniium 90000 X-Series oscilloscope family to
        include the world's highest performance mixed-signal oscilloscope, or
        MSO.  The expansion adds six new MSO models, as well as 13-GHz DSO and
        DSA models, to the X-Series.
    --  Signal Integrity Software, Inc. (SiSoft(TM)) announced that it has
        developed an interface to SAS' JMP(®) statistical discovery software
        that, for the first time, lets high-speed system designers characterize
        extremely large design spaces to make informed engineering decisions.
    --  Rambus unveiled the innovative R+ enhanced industry standards platform,
        which offers commercial benefits of industry-standard memory and
        chip-to-chip interfaces while enabling customers to differentiate
        products through specialized solutions.  Additionally, Rambus showcased
        innovations in 3D IC interposer technology.
    --  Teledyne LeCroy showcased the latest innovations in signal integrity
        test and measurement, including the LabMaster 10 Zi Series, the world's
        highest bandwidth oscilloscope with 65 GHz on up to 40 channels; the
        HDO, the industry's first 12-bit high definition oscilloscope; and the
        SDAIII-CompleteLinQ, a new multilane serial data analysis package for
        oscilloscopes that simultaneously displays four eye diagrams and other
        analysis.
    --  Rohde & Schwarz held standing-room-only training sessions on Phase Noise
        and Jitter Measurements, USB 2.0 Compliance Testing and Synchronous Time
        and Frequency Domain Measurements Using a Digital Oscilloscope.
    --  FCI announced its advanced ExaMAX(TM) high-speed backplane connector
        technology, which is designed to provide a path for future designs up to
        40 Gb/s.  The revolutionary ExaMAX(TM) connector design combines a new
        connector terminal design technology that significantly decreases
        terminal stub and ground-mode resonances with a compact form-factor and
        an optimized PCB footprint for easier and more flexible user system
        design.
    --  3M announced the full launch of its Embedded Capacitance Material (ECM)
        C2006.  With a capacitance density of approximately 20 nF per square
        inch, the ultra-thin laminate material offers one of the highest
        capacitance densities currently available on the market in a
        halogen-free* product and is now available for high-volume
        manufacturing.
    --  Ohmega Technologies introduced its OhmegaPly(®) MTR(TM) Technology,
        which allows thin film resistors to be built within a printed circuit
        trace that is less than 100 microns (0.004") wide.  Using standard
        subtractive printed circuit board processes, it is ideal for high
        density interconnect (HDI) designs where passive component placement is
        difficult or impossible.
    --  Hittite Microwave Corporation launched the HMC6545LP5E, a low power,
        high performance and fully programmable dual channel asynchronous
        advanced linear equalizer that operates with data rates up to 32 Gbps
        and is ideal for a wide range of networking and fiber optic
        applications.

The expo also featured DesignCon's annual award programs, which recognized best-in-class companies in electronics and test and measurement.

    --  View Best in Test Award Winners
    --  View Design Vision Award Winners

Additional information about the DesignCon 2013 conference and expo is available at http://www.designcon.com, on Facebook and on Twitter.

About UBM Tech
UBM Tech is a global media business that provides information, events, training, data services, and marketing solutions for the technology industry. Its media brands and information services inform and inspire decision makers across the entire technology market -- engineers and design professionals, software and game developers, solutions providers and integrators, networking and communications executives, and business technology professionals. UBM Tech's industry-leading media brands include EE Times, Interop, Black Hat, InformationWeek, Game Developer Conference, CRN, and DesignCon. The company's information products include research, education, training, and data services that accelerate decision making for technology buyers. UBM Tech also offers a full range of marketing services based on its content and technology market expertise, including custom events, content marketing solutions, community development and demand generation programs. UBM Tech is a part of UBM (UBM.L), a global provider of media and information services with a market capitalization of more than $2.5 billion.

For more information on DesignCon 2013 or UBM Tech please contact:

Linda Uslaner, UBM Tech, Electronics
516-562-5843 | linda.uslaner@ubm.com

Christine Stieglitz, BtB Marketing Communications
919-872-8172 | christine.stieglitz@btbmarketing.com

SOURCE UBM Electronics