SAN JOSE, CA -- (Marketwired) -- 12/03/13 --
Where: 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) Burlingame, California
When: December 11-13, 2013
Who: Javier DeLaCruz, eSilicon's senior director of engineering, will be part of the session on "Practical Perspectives on Thin Wafer Handling and Direct Bonding."
About Javier DeLaCruz
Javier DeLaCruz is the senior director of engineering at eSilicon. He is responsible for foundry, packaging, signal integrity, product and test engineering. He has also led eSilicon's 2.5D and 3D MoZAIC package system initiatives. DeLaCruz has over 17 years of experience in semiconductor packaging and is a senior member of IEEE. He has extensive knowledge in analog design, high-speed digital design, thermal and electrical simulation, and package assembly.
About 3D ASIP
3D ASIP is the leading industry event in 3D integration and packaging. 3D ASIP presents a broad, yet thorough perspective on the techno-market opportunities and challenges offered by building devices and systems in the vertical dimension, and provides participants the opportunity to gain the latest technology and market insights on 3D integration and packaging efforts, and technology and industry trends impacting this dynamic arena.
eSilicon, the largest independent semiconductor design and manufacturing services provider, delivers custom ICs and custom IP to OEMs, independent device manufacturers (IDMs), fabless semiconductor companies (FSCs) and wafer foundries through a fast, flexible, lower-risk path to volume production. eSilicon serves a wide variety of markets including the communications, computer, consumer, industrial products and medical segments.
eSilicon -- Enabling Your Silicon Success
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