CHANDLER, Ariz. -- (BUSINESS WIRE) -- Amkor Technology, Inc. (Nasdaq: AMKR) today announced that Dr. Choon Heung Lee has been appointed Executive Vice President and Chief Technology Officer.
“Choon has been a key contributor in securing Amkor’s position as the technology leader in the semiconductor packaging and test industry,” said Steve Kelley, Amkor’s President and CEO. “With his years of experience in R&D, product engineering and our commercial business units, Choon is uniquely qualified to lead our global strategic initiatives for developing and commercializing the innovative technologies demanded by our customers.”
Dr. Lee joined Amkor in 1996 and has served in various senior management positions during his time with the company, including most recently as Corporate Vice President, Business and Technology Management. Dr. Lee also has written 23 research papers on various packaging technology related subjects and has been granted 26 patents in Korea and 11 in the US. He holds a degree in physics and a Masters degree in statistical physics from Korea University, and a Masters degree and Ph.D. in physics from Case Western Reserve University.
Amkor is a leading provider of semiconductor packaging and test services to semiconductor companies and electronics OEMs. More information on Amkor is available from the company's SEC filings and on Amkor's website: www.amkor.com.