FREMONT, CA -- (Marketwired) -- 04/22/14 -- Mattson Technology, Inc. (NASDAQ: MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, has expanded its etch market position with shipments to DRAM, 3D NAND and wafer level packaging fabs in the first quarter of 2014. These shipments are the result of new etch applications released for production on Mattson's paradigmE line of etch systems. DRAM production transitions to sub-3x nanometer (nm) technology nodes are being driven by the increased demand for memory in mobile devices. In NAND memory, 3D memory arrays are used to increase the memory density per square area of each chip. Also, increased use of multi-chip packaged modules in many consumer products is creating new technical requirements for wafer level packaging process flows. Mattson continues to develop new processes and hardware in order to meet all of these demands.
"Following our new etch qualifications at the end of 2013, additional paradigmE XP systems were required to support the production ramps of sub-3x nm DRAM and 3D NAND earlier this year," said Rene George, Vice President and General Manager of Mattson Technology's Plasma Products Group. "In addition, at the beginning of this year we worked in close partnership with our customer to develop and qualify new process applications required for advanced multi-chip modules. These advances in Mattson's etch application portfolio will provide the opportunity for continued expansion of our market position in 2014."
About Mattson Technology, Inc.
Mattson Technology, Inc. designs, manufactures and markets semiconductor wafer processing equipment used in the fabrication of integrated circuits. We are a leading supplier of plasma and rapid thermal processing equipment to the global semiconductor industry, and operate in four primary product sectors: Dry Strip, Etch, Rapid Thermal Processing and Millisecond Anneal. Through manufacturing and design innovation, we have produced technologically advanced systems that provide productive and cost-effective solutions for customers fabricating current- and next-generation semiconductor devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, CA, 94538. Telephone: (800) MATTSON / (510) 657-5900. Internet: www.mattson.com.
"Safe Harbor" Statement Under the Private Securities Litigation Reform Act of 1995: This news release contains forward-looking statements. All statements other than statements of historical fact are statements that could be deemed forward-looking statements, including but not limited to statements regarding the company's performance and ability to convert new market opportunities, plans, strategies and objectives of management for future operations. Forward-looking statements address matters that are subject to a number of risks and uncertainties that can cause actual results to differ materially from those expressed or implied by such forward-looking statements and assumptions. Such risks and uncertainties include, but are not limited to: macroeconomic and geopolitical trends and events; end-user demand for semiconductors; customer demand for semiconductor manufacturing equipment; the timing of significant customer orders for the Company's products; customer acceptance of delivered products and the Company's ability to collect amounts due upon shipment and upon acceptance; the Company's ability to timely manufacture, deliver and support ordered products; the Company's ability to bring new products to market and to gain market share with such products; customer rate of adoption of new technologies; risks inherent in the development of complex technology; the timing and competitiveness of new product releases by the Company's competitors; the Company's ability to align its cost structure with market conditions; and other risks and uncertainties described in the Company's Forms 10-K, 10-Q and other filings with the Securities and Exchange Commission. The Company assumes no obligation to update the information provided in this news release.