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Interlink Electronics, Inc. to Make Presentations at Two Leading Micro-Cap Investor Conferences in May 2014

Companies mentioned in this article: Interlink Electronics, Inc.

CAMARILLO, Calif. -- (BUSINESS WIRE) -- Interlink Electronics, Inc. (OTC: LINK), a global leader in human-machine interface and sensor technologies, announced that in the month of May that it will present at both at the Sidoti Ninth Semi-Annual Micro-Cap Conference and the Marcum Third Annual Micro-Cap Conference. These conferences are among the leading micro-cap conferences in terms of the numbers of presenting public companies and institutional investors that participate in these interactive events. Dr. Howard D. Goldberg, President and COO, will make a presentation regarding Interlink Electronics’ operations and growth strategy at each conference. Dr. Goldberg commented, “We feel that Interlink Electronics has a proven industry track record and an exciting growth plan to present to the investor community and we appreciate the opportunity to exhibit Interlink Electronics, Inc. at the Sidoti and Marcum conferences.”

The Sidoti Micro-Cap Conference will take place on May 9, 2014 at the Grand Hyatt New York, 109 East 42nd Street, New York City. Interlink Electronics’ presentation is scheduled to take place at 1:20 PM ET in room Estate 5. Additionally, Steven N. Bronson, the Chairman and Chief Executive Officer of Interlink Electronics will be participating in the conference. Mr. Bronson and Dr. Goldberg will be available to meet with members of the investment community during one-on-one sessions being held at the conference. Members of the investment community interested in meeting with management that day can contact their representative at Sidoti & Company, LLC. For more information or to register for the conference, please visit http://microcap.sidoti.com.

The Marcum Micro-Cap Conference will take place on May 29, 2014 at the Grand Hyatt New York, 109 East 42nd Street, New York City. Dr. Goldberg will be available to meet with members of the investment community during one-on-one sessions being held at the conference. Members of the investment community interested in meeting with management that day can contact their representative at Marcum LLP. For more information or to register for the conference, please visit http://www.marcumllp.com/microcap.

About Interlink Electronics, Inc.

Interlink Electronics is a world-leading trusted advisor and technology partner in the advancing world of human-machine interface and sensor technologies. Interlink Electronics has led the printed electronics industry in its commercialization of its patented Force-Sensing Resistor (FSR®) technology, which has enabled rugged and reliable human-machine interface ("HMI") solutions. For over 29 years, Interlink Electronics' solutions have focused on handheld user input, menu navigation, cursor control, and other intuitive interface technologies for the world's top electronics manufacturers. Interlink Electronics has a proven track record of supplying human-machine interface solutions for mission-critical applications in a wide range of markets, including, but not limited to, consumer electronics, automotive, industrial, and medical devices. Interlink Electronics serves a world-class customer-base from its corporate headquarters in Camarillo, California (greater Los Angeles area), printed-electronics factory in China, distribution and warehouse facility in Hong Kong, global R&D office in Singapore, global sales office in the United Kingdom, and sales office in Japan. For more information, please see http://www.interlinkelectronics.com.

FORWARD LOOKING STATEMENTS: This release contains "forward-looking statements" involving a number of risks and uncertainties as defined in the Private Securities Litigation Reform Act of 1995. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: historical losses and negative cash flow, the success of business divestitures and acquisitions, the ownership of the majority of our stock by a small group of investors, our success in predicting new markets and the acceptance of our new products, efficient management of our infrastructure, the pace of technological developments and industry standards evolution and their effect on our target product and market choices, the effect of outsourcing technology development, changes in the ordering patterns of our customers, a decrease in the quality and/or reliability of our products, protection of our proprietary intellectual property, competition by alternative sophisticated as well as generic products, pending litigation against Interlink Electronics, historical weaknesses in internal controls over financial reporting, continued availability of raw materials for our products at competitive prices, disruptions in our manufacturing facilities, risks of international sales and operations including fluctuations in exchange rates, compliance with regulatory requirements applicable to our manufacturing operations, and customer concentrations. The forward-looking statements contained in this release should be considered in light of these risk factors.


Copyright © Business Wire 2014
Contact:

Interlink Electronics, Inc.
Howard D. Goldberg, Ph.D., President and COO
805-484-8855 ext. 114
hgoldberg@iefsr.com
or
Gary Rubin, Corporate Controller
805-484-8855 ext. 138
grubin@iefsr.com