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Interlink Electronics, Inc. Announces a New Addition to the Global Sales and Business Development Team

Companies mentioned in this article: Interlink Electronics, Inc.

CAMARILLO, Calif. -- (BUSINESS WIRE) -- Interlink Electronics, Inc. (OTC: LINK), a global leader in sensor and human-machine interface technologies, is pleased to announce that Mr. William Tan joined the Company on July 3, 2014, in the new role of Regional Sales & Business Development Manager APAC (excluding Japan). Mr. Tan will report to Mr. Neil Jarvie, Vice President of Global Sales & Business Development. Mr. Tan will be based from Interlink Electronics’ subsidiary in Singapore and have sales and business development responsibility for the Asia Pacific (“APAC”) region with the exception of Japan. The Company’s Japan regional sales and business development activities will continue to be managed by Mr. Toshiki Okabayashi, who also reports to Mr. Neil Jarvie.

Mr. Tan comes to Interlink Electronics with over 20 years of experience in high-technology sales, strategic account and general management. Since 2006, Mr. Tan was the General Manager of the Hong Kong and greater China regions for RRC Power Solutions, a specialist in charging solutions for the Medical, Military and IT industries. Previously, Mr. Tan established and ran the Shanghai Sales Office and Design Center at Cypress Semiconductor, where his efforts directly led to a tenfold increase in revenue within a 5-year timeframe. Additionally, Mr. Tan has held various strategic regional sales positions with increasing responsibility at Rohm Semiconductor, based in Singapore.

“Interlink Electronics is delighted to have Mr. William Tan join our expanding global Sales and Business Development team and he will be instrumental in driving our rapidly growing HMI solutions portfolio into the commercially important APAC region,” stated Mr. Neil Jarvie, Vice President of Sales & Business Development at Interlink Electronics. Mr. Jarvie continued: “I look forward to the opportunity to work with William again as his track record of business development and sales success in the APAC region speaks for itself. He is an important strategic addition to the Interlink Electronics team and his appointment marks another step in the build-out of our direct global sales infrastructure.”

About Interlink Electronics, Inc.

Interlink Electronics is a world-leading trusted advisor and technology partner in the advancing world of human-machine interface and sensor technologies. Interlink Electronics has led the printed electronics industry in its commercialization of its patented Force-Sensing Resistor (FSR®) technology, which has enabled rugged and reliable human-machine interface (“HMI”) solutions. For over 29 years, Interlink Electronics' solutions have focused on handheld user input, menu navigation, cursor control, and other intuitive interface technologies for the world's top electronics manufacturers. Interlink Electronics has a proven track record of supplying human-machine interface solutions for mission-critical applications in a wide range of markets, including, but not limited to, consumer electronics, automotive, industrial, and medical devices. Interlink Electronics serves a world-class customer base from its corporate headquarters in Camarillo, California (greater Los Angeles area), printed-electronics factory in China, distribution and warehouse facility in Hong Kong, global R&D office in Singapore, global sales office in the United Kingdom, and sales office in Japan. For more information, please see our website at:

FORWARD-LOOKING STATEMENTS: This release contains "forward-looking statements" involving a number of risks and uncertainties as defined in the Private Securities Litigation Reform Act of 1995. The following are among the factors that could cause actual results to differ materially from the forward-looking statements: historical losses and negative cash flow, the success of business divestitures and acquisitions, the ownership of the majority of our stock by a small group of investors, our success in predicting new markets and the acceptance of our new products, efficient management of our infrastructure, the pace of technological developments and industry standards evolution and their effect on our target product and market choices, the effect of outsourcing technology development, changes in the ordering patterns of our customers, a decrease in the quality and/or reliability of our products, protection of our proprietary intellectual property, competition by alternative sophisticated as well as generic products, pending litigation against Interlink Electronics, historical weaknesses in internal controls over financial reporting, continued availability of raw materials for our products at competitive prices, disruptions in our manufacturing facilities, risks of international sales and operations including fluctuations in exchange rates, compliance with regulatory requirements applicable to our manufacturing operations, and customer concentrations. The forward-looking statements contained in this release should be considered in light of these risk factors.

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Interlink Electronics, Inc.
Howard D. Goldberg, Ph.D., President and COO
805-484-8855, ext. 114
Steven N. Bronson, CEO
805-583-7744, ext. 154