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GLOBALFOUNDRIES
News articles for GLOBALFOUNDRIES:
Monday, April 29, 2013
- Infineon and GLOBALFOUNDRIES Announce Joint Development and Production Collaboration for 40nm Embedded Flash Process TechnologyInfineon Technologies (FSE: IFX / OTCQX: IFNNY) and GLOBALFOUNDRIES Inc. today announced a joint technology development and production agreement for 40 nanometer (nm) embedded flash (eFlash) process technology. ... read more
Monday, April 22, 2013
- GLOBALFOUNDRIES Names Shigeru Shimauchi as New Country Manager For Japan Sales OfficeGLOBALFOUNDRIES today announced that the appointment of a new country manager for its sales office in Japan. ... read more
Tuesday, April 2, 2013
- GLOBALFOUNDRIES Demonstrates 3D TSV Capabilities on 20nm TechnologyGLOBALFOUNDRIES today announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications. At its Fab 8 ... read more
Tuesday, February 19, 2013
- GLOBALFOUNDRIES Offers Enhanced 55nm CMOS Logic Process with ARM Next-Generation Memory and Logic IP Support for Low VoltageGLOBALFOUNDRIES today announced additional enhancements to the foundry’s 55-nanometer (nm) Low-Power Enhanced (LPe) process technology platform – 55nm LPe 1V – with ... read more
Tuesday, February 5, 2013
- GLOBALFOUNDRIES and Rambus Collaborate To Develop Broad IP Portfolio for 14nm-XM FinFET Process TechnologyAt today’s Common Platform Technology Forum, GLOBALFOUNDRIES, and Rambus Inc. (NASDAQ:RMBS), the innovative technology solutions company, unveiled plans to collaborate for the development of a broad portfolio ... read moreGLOBALFOUNDRIES To Offer Adapteva’s Processor IP For 28nm SoC DesignsAt today’s Common Platform Technology Forum, GLOBALFOUNDRIES announced a partnership with Adapteva to offer the company’s Epiphany IV microarchitecture to customers using GLOBALFOUNDRIES’ leading-edge ... read moreGLOBALFOUNDRIES Details 14nm-XM FinFET Technology Performance, Power and Area Efficiency with a Dual-core Cortex-A9 Processor ImplementationAt today’s Common Platform Technology Forum, GLOBALFOUNDRIES announced results from the industry’s first implementation of a dual-core ARM® Cortex™-A9 processor using three-dimensional 14nm-XM ... read moreGLOBALFOUNDRIES and Synopsys Partner To Provide Comprehensive Design Environment for Foundry’s 14 nm-XM FinFET OfferingGLOBALFOUNDRIES and Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced the two companies ... read moreGLOBALFOUNDRIES and Cyclos Semiconductor Partner to Develop High-Performance, Low-Power ARM Cortex-A15 Processors Using Resonant Clock Mesh TechnologyAt today’s Common Platform Technology Forum, GLOBALFOUNDRIES and Cyclos Semiconductor, the inventor and only supplier of resonant clock mesh (RCM) technology for commercial IC designs, announced plans to ... read more
Tuesday, January 15, 2013
- Alexie Lee Recognized with Women in Manufacturing STEP AwardGLOBALFOUNDRIES today announced Alexie Lee, general counsel and executive vice president of legal and corporate affairs, was recognized by The Manufacturing Institute, ... read more
Wednesday, January 9, 2013
- Nitero Demonstrates High-Speed 60GHz Wi-Fi Solution on GLOBALFOUNDRIES' 65nm-LPe RF TechnologyToday at the 2013 Consumer Electronics Show (CES), Nitero, a fabless semiconductor company developing next-generation Wi-Fi solutions for mobile devices, demonstrated its innovative 60GHz Wi-Fi solution ... read more
Tuesday, January 8, 2013
- GLOBALFOUNDRIES to Build R&D Facility in New York to Accelerate Advanced Manufacturing Technologies for Global CustomersGLOBALFOUNDRIES today announced plans to build a new global R&D facility at its Fab 8 campus in Saratoga County, N.Y. The new Technology Development Center ... read more