Palomar Technologies, provider of precision automation equipment, process development, and assembly services for microelectronic assembly, will present High Brightness Matrix LED Assembly Challenges and Solutions by Daniel D. Evans, Jr., Palomar’s senior scientist. Philip Couts, TDK Corporation of America, will present Gold Stud Bumping for High Density Flip Chip Interconnect, co-authored by Mr. Evans. The IMAPS symposium will be held November 11 to 15, 2007 in San Jose, California.

The presentation High Brightness Matrix LED Assembly Challenges and Solutions details research that shows how pulsed heat eutectic die attach and wire chain bonding used in matrix LED assembly are used to maximize the power and light [lumens] from high power LED matrices. A matrix of LED devices is packaged together for applications such as camera phone flashes, televisions, display backlighting, and automotive and architectural lighting. Reaching performance and cost targets requires continuous improvements in LED devices and packaging to extract every possible lumen per watt.

The paper Gold Stud Bumping for High Density Flip Chip Interconnect details a robust flip chip solution using the Gold to Gold Interconnect (GGI) process for device packaging companies. The GGI process is a high precision interconnect method for flip chip die attach that uses the same thermosonic techniques used in gold wire bonding. Compared to gold wire bonding, GGI flip chip can reduce the device package area 50% to 70%, improves electrical performance, and is a clean, lead-free process and a cost effective solution for low to medium I/O devices.

The International Microelectronics and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.

About Palomar Technologies

Palomar Technologies, established in 1975 as part of Hughes Aircraft Company, became independent in 1995. Palomar’s automated high-precision component assembly and precision ball and wedge bonding systems increase yield and lower costs for manufacturers in the wireless, medical, microwave, computer, automotive, aerospace and life sciences industries. Palomar Microelectronics, the assembly and test division of Palomar Technologies, Inc., offers process development and assembly services including advanced wire bonding, gold ball bumping, and direct-chip-attach of eutectic and epoxy bonded high-power LEDs, MEMS devices, microwave & RF components, optoelectronic packages, multi-chip modules, and hybrids. Services include process development, prototyping, volume assembly and test.

For more information, visit www.palomartechnologies.com [1] or contact 760-931-3600.