Published on FreshNews.com (http://www.freshnews.com)
Palomar Technologies Features High Throughput Automated Wire Bonding and Bumping plus Palomar Microelectronics at Productronica
By admin
Created 11/06/2007 - 8:35am

  • Telecom/Wireless
  • California

Palomar Technologies, provider of precision automation equipment, process development, and assembly services for microelectronics, will feature its Model 8000 for high throughput automated wire bonding and ball bumping and will introduce Palomar Microelectronics to Europe at Productronica, stand B5.158, in Munich, Germany, November 13-16, 2007.

The model 8000 represents the latest advances in wire bonders, incorporating leading-edge mechanical design, control architecture, and graphical user interface to provide the highest net throughput and flexibility of any comparable tool on the market today.

Palomar Microelectronics is a fast-growing segment of the company created by the demand for quick-turn product development, prototyping, test, and assembly services. Microelectronic assembly processes include advanced wire bonding, gold ball bumping, and precision component placement for semiconductor packages, high power LEDs, MEMS devices, microwave and RF components, optoelectronic packages, multichip modules, and hybrids.

“Our experience with design, engineering, prototyping, assembly, automation, and metrology means that we can work with a customer from concept up to, and into, production,” said Josef Schmidl, managing director Palomar Technologies Europe. “We can demonstrate the viability of new products by developing prototypes with the equipment and processes needed for high volume manufacture, providing high-value-added assembly services for advanced packaging companies.”

About Palomar Technologies

Palomar Technologies (formerly part of Hughes Aircraft Company) is one of the world’s principal suppliers of automated high-precision wire bonders and component placement systems along with process development and assembly services to increase yield and lower costs for manufacturers of optoelectronic, RF, and microelectronic packages in the wireless, photonic, LED, microwave, photovoltaic, computer, automotive, aerospace, and medical industries.

For more information on Palomar Technologies and Palomar Microelectronics, visit http://www.palomartechnologies.com [1] or contact 760-931-3600.


Company Mentioned: 
Palomar Technologies [2]

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Source URL: http://www.freshnews.com/news/71529/palomar-technologies-features-high-throughput-automated-wire-bonding-and-bumping-plus-pal

Links:
[1] http://www.palomartechnologies.com
[2] http://www.freshnews.com/company/palomar-technologies